PixelCam 6 Band VIS+3xNIR

PixelCam multispectral cameras provide live imaging of 3-9 spectral bands at video rates. Simultaneous multi-channel “snapshot” acquisition delivers rich, real-time data without scene change or pixel shift. Custom dichroic filter arrays are integrated into the focal plane array at wafer-level to create robust linear and area sensors that extract high-contrast spectral information at specific visible and infrared wavelengths. This breakthrough technology enables easy integration into handheld, mobile and aerial cameras – all with the same frame rate, size, weight and power consumption as monochrome cameras.

PixelCam cameras are fabricated to user-defined wavelengths. The unique combination of high-speed, multi-band imaging and small form factor supports a variety of dedicated applications including agriculture, biomedical, machine vision, surveillance, authentication and unmanned systems. Customized OEM multispectral camera modules are engineered from the wafer-level to deliver scalable volume production and easy integration into handheld and portable devices. Standard PixelCam camera modules are available for 4 band and 6 band RGB-NIR and SWIR wavelengths.

The PixelCam 6 band RGB+3xNIR is based on the Adimec Opal 4MP camera. This snapshot mulitpsectral imager (spectral response shown below) has 6 unique bands in a custom “mosaic” type filter. The 6 band filter is arranged in a unique pattern to maximize the NIR signal, as the quantum efficiency is lower in these areas. As such, the NIR channels in the “mosaic” filter are 2×4 pixels and the RGB filters bin 4 pixels (2×2).  Applications include sorting, industrial QC and medical imaging. Users can also utilize a “pre-filter” to further define the bands to use the camera with narrower bands. Reach out to our applications engineers for the details. BUY NOW

Spectral Response

PIXELTEQ micro-pattered optical filters, like PixelCam, are covered by patents in micro-patterning technologies (US patent 7648808) and pixel filter array on substrate (either glass or directly on sensor/detector wafers) methodologies (US patent  6638668).